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Standard sample stages of Electron Microscopes are
not very precise in positioning. Often the user likes to have something
more precise, e.g. for automatic Wafer Probing or sample alignment during
e-beam lithography, perhaps after years of using the SEM. The exchange
of the sample stage is expensive, perhaps impossible. But adding Nanorobotics
modules is easy: Just place them onto the existing sample stage, and we
will add a feedthrough and configured cables. The following turnkey
solution ist sold by Raith GmbH Dortmund, Germany, using our Nanorbotics
stages in any kind of SEM chamber that can be used for e-beam Lithography:
"XY-positioning and stitching improvements
for conventional SEM based lithography solutions by piezoelectric sub-stage
assembly" *
Raith GmbH Dortmund, Germany:
Introduction:
Conventional SEM stages are lacking the precision for certain lithography
procedures; while conventional step and repeat of single exposure fields
do not require better stage performance, advanced lithography techniques
which for example employ the so-called stitching technique, cannot be
executed with sufficient success. Typically a repeatability of a few micrometers
is insufficient for precise exposure field size calibration as well as
for the stitching technique by subsequent exposure of adjacent exposure
fields.
Functionality:
The two axes piezoelectric sub-stage assembly has been optimised for
the use in SEM based EBL applications. It will be installed as a reversible
sub-stage assembly on top of the original SEM stage. High precision encoders
enable the individual single sub-stage positioning axes to attain a reproducibility
of about 100 nm. Two axes repeatability is in the range of a few 100 nm
and suitable for Mix & Match tasks.

Piezo electric sub-stage assembly in a FE SEM
The sub-stage enables stitching with typically sub
micron accuracy (mean + 2 Sigma). The sub-stage assembly is controlled
via proprietary Raith software drivers, to ensure an optimum integration
level into the ELPHY Lithography Suite.

Four exposure fields with stitched patterns demonstrating sub micron stitching
accuracy - red dotted line indicates exposure field boundary
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* The upper text is an extract of an application
note, published by Raith
August 2004.
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