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Microassembly with Nanometer Resolution
Assembly of Terahertz Frequency Mixers |
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The Superconducting Devices and Mixers Group
at In order to minimize the loss of 800 GHz RF-Power inside of the receiving waveguide, the total dimensions of the fused quartz mixer substrates have to be 80 µm by only 2 µm (width x height) and 1600 µm long. The manual mounting of these devices into the substrate channel is rather difficult, not reproducible and ends mostly by breaking the device. For array and satellite applications on the other hand, a reliable and reproducible mounting procedure is of utmost importance. The requirements for the coming 1.9 THz receiver for the SOFIA-aeroplane will be even higher. Another point of concern is the sensitivity of some of the devices against electrostatic discharge, being much higher than the sensitivity of semiconductor devices. That is why the KOSMA group used a Klocke Nanotechnik microassembly stage. The main problem is gripping the fragile device. The two fingers of the gripper are just 200 µm by 300 µm strong. Any standard stepper motor would break the device or even bend the tiny fingers as soon as they try to grip. For further information, please download the application paper (see right).
SEM picture of the assembled device:
It is centered and precisely aligned parallel to the waveguide. |
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